/ Two-component addition-cure potting compound for control modules and sensors

Two-component addition-cure potting compound for control modules and sensors

Publish Time:2026-07-14 Source: Bont Electronics

Used to protect various automotive electronic control modules such as engine control modules, HID lamp modules, wiper controllers, power system modules, powertrain modules, brake system modules, exhaust emission control modules, lighting systems, various sensors, connectors, etc.

Features: It has good adhesion performance and excellent dielectric properties, can prevent dust and water seepage, prevent solder joints from falling off, and provides sufficient insulation protection. It meets the basic requirements of withstanding high and low temperature shocks, moisture resistance, contamination resistance, and corrosion resistance, while also providing a certain heat dissipation effect. After curing, the product has good elasticity and can meet the electrical appliance's needs for shock resistance and impact resistance. The addition-type product has a very low shrinkage rate, does not produce low molecules during the curing process, and can cure quickly after heating.

 

← Previous post
Two-component addition-cure high-thermal-conductivity potting adhesive for chargers and vehicle-mounted high-power modules
Next →
Sealant for automotive airbags

Related Applications

Two-component epoxy structural adhesive
Two-component epoxy structural adhesive
2026-07-14
Transformer air gap adhesive
Transformer air gap adhesive
2026-07-14
New energy vehicle electronic water pump fixing adhesive
New energy vehicle electronic water pump fixing adhesive
2026-07-14
Epoxy resin for capacitor encapsulation of new energy vehicles
Epoxy resin for capacitor encapsulation of new energy vehicles
2026-07-14
💬
在线客服
在线
✕
对方正在输入...
您有任何问题可以咨询我们