Used for sealing automotive multimedia display screens and touch screen flexible printed circuit boards (FPC).
The product has high bonding strength, low internal stress, and vibration resistance. It passes dual 85 and salt spray tests, withstands thermal shock and high-low temperature cycling, is low-halogen, environmentally friendly, and low-volatility. It provides excellent adhesion to components on FPC and polyimide (PI) surfaces. It can also be used as an adhesive for reinforcement, strengthening, vibration resistance, and solder joint oxidation prevention at the soldering areas of various touch chip ICs. The product cures quickly.
