Used for structural adhesive bonding of complex module die-castings for automotive displays, and bonding of sensor die-castings to PCB boards, replacing traditional screw fixation, reducing weight by 30% while improving shock resistance
Fast initial fixation capability: The dedicated pressure-free PUR adhesive reaches initial bonding strength within 3-5 minutes after dispensing, enabling rapid fixation of component positions without the need for additional pressure-holding fixtures.
Moisture curing mechanism: Final curing is completed by absorbing moisture from the air, and no shrinkage occurs during the curing process, preventing component displacement.
Wide temperature range adaptability: Meets the demanding environmental requirements of automotive, new energy, and other fields.
| ?Properties? | BE-1135 | BE-1135B |
| Color | Black | Black |
| Open time [mins] | 3~6 | 3~6 |
| Hardness Shore | A70 | A70 |
| Viscosity [mPa-s] | 5,000?~10,000 | 7000 |
| Preheat temperature [℃] | 130(20min) | 130(20min) |
| Application temperature [℃] | 120-150 | 130 |
| Valve temperature [℃] | 150-180 | 150-180 |
| Pull strength [Kgf/100mm2] | >70 | >70 |
| Elongation at break % | >700 | >700 |
| Shear strength [MPa] | 12 | 12 |
