Epoxy-based UV adhesive is a cationic photocuring system, a one-component adhesive made primarily from epoxy resin or modified epoxy oligomers, combined with photoacid generators and other initiators. Under ultraviolet light irradiation, it generates active cations that initiate ring-opening polymerization of epoxy groups to cure. It combines the efficiency advantage of photocuring's "second-level setting" with the high strength and low shrinkage characteristics of epoxy resin, making it another important choice for high-end precision photocuring bonding.
Contact UsIts most notable characteristic is that the curing reaction can continue even after light exposure stops (post-curing or dark curing), effectively solving the curing challenge in shadowed areas that cannot be reached by light. At the same time, it inherits the excellent adhesion, extremely low volumetric shrinkage, and outstanding chemical and high-temperature resistance of epoxy resins. It also has no oxygen inhibition effect, and the curing process is insensitive to moisture, making it particularly suitable for precision bonding of complex-shaped components.
??High-end electronic packaging: chip bonding and lens base fixation for CMOS/CCD camera modules, solving curing challenges in blind spots.
??Semiconductors and MEMS: chip underfill and encapsulation, wafer-level bonding of MEMS sensors, leveraging its low shrinkage to prevent deformation of precision structures.
??Optical communication devices: precision alignment bonding of active components such as fiber collimators and wavelength division multiplexers, requiring dimensional stability under long-term temperature and humidity environments.
??Automotive electronics: sealing and structural bonding of safety sensors, tire pressure monitoring modules, and ADAS camera modules, requiring resistance to high temperatures and harsh environments.
??Medical devices: bonding and encapsulation of precision catheters and endoscope components that require high reliability and resistance to repeated sterilization.
??Advanced manufacturing: bonding of microfluidic chips, and other fields with extreme requirements for shadow curing, low shrinkage, and high-temperature dimensional stability.
