One-component room temperature thermally conductive adhesive

Product Description

Core Features:

It combines the dual functions of adhesive fixation and efficient thermal conductivity. After curing, it becomes an elastomer that can work stably over a wide temperature range of -60℃ to 280℃, and also offers excellent electrical insulation, weather resistance, and resistance to vibration and impact.

Typical Application Scenarios

? New Energy Vehicle Sector

• Used for heat dissipation bonding of IGBT/SiC modules in power battery packs, motor controllers, and onboard chargers, ensuring stable heat dissipation for power components under complex high-temperature and vibration environments.

? Consumer Electronics Industry

• Applied between the CPU/GPU and heat dissipation substrate of smartphones and laptops, it fills interface gaps through bonding, improves heat conduction efficiency, and supports the development of electronic devices toward miniaturization and high performance.
• Used for chip heat dissipation in wearable devices such as smartwatches and bands. Its low-volatility property avoids volatiles contaminating internal precision sensors and ensures detection accuracy.

? Industrial and Communication Scenarios

• Provides heat dissipation bonding for power modules in industrial inverters and server power supplies, enabling long-term operation under high-temperature environments and reducing equipment maintenance costs.

? Security and Outdoor Equipment

• Used for chip heat dissipation in outdoor security surveillance cameras. It can still maintain elasticity and thermal conductivity under a wide temperature environment from -40℃ to 60℃. Its low oil bleed property avoids oil contamination of the lens and ensures nighttime imaging quality.