Used for shell sealing and bonding of motors, inverters, IGBTs, ECUs, PTCs, and various vehicle controllers, replacing traditional sealing rings. Can be used in CIPG and FIPG processes
Features: heat curing, excellent temperature resistance, bonds to various materials, especially very good adhesion to metals, low odor, does not contain xylene or toluene, meets VOC requirements, good weather resistance, moisture-proof, shock-resistant, UV-resistant, waterproof, will not change its performance due to harsh weather environments, mainly used for bonding and fixing motors, inverters, PTCs, and devices with high temperature resistance requirements, and also used for bonding and sealing various controller housings.
