Used for sealing and protection of chip pins, IC pins, and circuit board solder joints
Features: The product is non-corrosive, has controlled low ion and low molecular content, cures quickly at room temperature, and is in a semi-thixotropic semi-flow state. After application, the adhesive spreads to encapsulate the pin solder joints without flowing. It is used for encapsulation around integrated circuit IC pins to protect the chip and provide reinforcement, giving it better cushioning performance. It is also used for solder joint sealing to prevent solder joint oxidation, with resistance to salt spray, damp heat, and corrosion. The product features low ions, low corrosion, low volatility, and high purity, and is used for sealing applications requiring high heat resistance and high strength.
