/ One-component addition-cure sealant

One-component addition-cure sealant

One-component addition-curing sealant is a one-component sealing material that cures using organosilicon as its base through an addition reaction, requiring no additional curing agent, and can cure under heating or at room temperature.

Product Description

Core Features:

It combines heat resistance, weather resistance, and the flexibility and adhesion of organic materials; the curing process produces no by-products and has extremely low shrinkage. After curing, it becomes an elastomer and can work stably for long periods within a temperature range of -60℃ to 280℃. Compared with traditional condensation-type sealants, addition-type sealants have superior high and low temperature resistance, electrical insulation, and anti-aging performance, and release no volatile substances, making them environmentally and human friendly.

The curing speed is significantly affected by temperature. Heating can accelerate curing, and it can also cure slowly at room temperature. The curing process is not affected by environmental humidity.

? Electronics and Electrical Appliance Industry

Used for bonding and fixing electronic components and sealing against moisture, such as positioning capacitors, resistors, and sensors, to prevent components from falling off due to vibration or short-circuiting due to moisture;
As a potting material for LED lamps, it protects the light beads and drive circuits, while also providing good thermal conductivity to assist heat dissipation;
Used for sealing semiconductor equipment, such as the packaging of chips and wafers, providing excellent electrical insulation and anti-aging performance.

? New Energy Vehicle Field

Used for heat-dissipation bonding of IGBT/SiC modules in power battery packs, motor controllers, and onboard chargers,

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